We have a comprehensive investigation of supplier credit qualifications and control quality from the beginning.Original Chip Hong Kong has its own quality control team, which can monitor and control quality throughout the process, including incoming, storage and delivery.
Contact with third-party testing capabilities of global authorities, by using the most advanced test machine, strictly test each high-precision component to ensure that their stability and compatibility can meet their own requirements.
Anti-static, moisturizing, anti-aging method and packaging method will strictly adopt inventory and transportation.We are responsible for returning or replacing components with quality problems.
1, visual inspection
2, X-ray check
3, tag durability test
4, DE-CAPSULATION test
5, pin allocation test
6, PB Free / RoHS test
7, electricity test
8, function test
For any component assessment, the first is also the most important step is a thorough inspection process.We have developed our procedures and acceptance criteria to detect and report evidence to resize water and refurbishment.
During the test, the drug resistance, drug resistance, size verification, marking code matching, high power amplification detection, and terminal conditions, etc. of the solvent are standard methods during our testing process.All inspections and observations are reviewed by quality engineers to assess whether we have seen a new forged technology or manufacturing.
Check and analyze a component to check the integrity of a person's hardware and changes between different devices.However, not all variants means forged devices.Understanding the manufacturing process and how the manufacturer supply chain and engineering control work, we can determine when it is made, not forged indicators.
The X-ray system is real-time, and the object can be rotated on all three shafts to obtain outstanding imaging capabilities, and analyze a single component and assembled circuit board.
This is a destructive test that removes the insulation material of the component to reveal the death.Then the mold and architecture are analyzed to determine the traceability and reliability of the device.Zoom in 1000 times The magnification is the necessary conditions for determining death markers and surface deformation.
Check and analyze a component to check the integrity of a person's hardware and changes between different devices.However, not all variants means forged devices.Understanding the manufacturing process and how the manufacturer supply chain and engineering control work, we can determine when it is made, not forged indicators.
The X-ray system is real-time, and the object can be rotated on all three shafts to obtain outstanding imaging capabilities, and analyze a single component and assembled circuit board.
This is not a forged method, because oxidation is natural; however, this is an important functional problem, especially in the southeast Asia and North America in the southeast Asia and North America in the southeast Asia and North America under the climate in Southeast Asia and North America, especially in the southeast Asia and North America.The Joint Standard J-STD-002 standard defines test methods and accept / reject standards for brushing, surface mounting, and BGA devices.Packaging is unsuitable packaging, acceptable packaging, but more than one year packaging, or pollution to the pin, it is recommended for solderableness testing.
Original Chip Hong Kong Limited , a partner, not a supplier!
Third Party authority test room.
Original Chip Hong Kong Limited , a partner, not a supplier!
Provide one-stop procurement for your cost / save time.
Material list (material list) is fully provided.
Original Chip Hong Kong Limited , a partner, not a supplier!
International Logistics DHL, FedEx, UPS, TNT.
The economy will transport goods through Hong Kong.
